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Thursday, October 31, 2024

Dow and Carbice join forces for new thermal interface materials

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Jim Fitterling Chair and Chief Executive Officer at Dow Chemical Company | Official website

Jim Fitterling Chair and Chief Executive Officer at Dow Chemical Company | Official website

Dow and Carbice have entered into a strategic partnership to develop thermal interface materials (TIM) for electronics in various industries, including mobility, industrial, consumer, and semiconductors. This collaboration was announced at The Battery Show North America. It combines Dow's experience in silicones with Carbice's carbon nanotube (CNT) technology to create innovative thermal management products.

Jon Penrice, President of Dow Mobility, emphasized the significance of this partnership: “Launching this partnership at the show reinforces Dow’s MobilityScience™ commitment to driving the future of mobility through cutting-edge material science." Jeroen Bello from Dow highlighted the benefits of combining liquid silicones with solid pads for enhanced customer service: "Partnering with Carbice enables us to enhance our service to customers by offering thermal management solutions."

The joint effort aims to offer reliable solutions that can operate in diverse environments by merging the strengths of silicone and CNTs. The collaboration will also focus on efficient design optimization and manufacturing processes.

Baratunde Cola, CEO and Founder at Carbice, stated: “Our partnership with Dow allows us to combine our high-performance, easy-to-use thermal interface solutions with their silicone technologies." This initiative is part of Carbice's mission to provide critical components for essential applications worldwide.

Visitors at The Battery Show North America can explore innovations from Dow MobilityScience™, including products developed through this partnership like Carbice® SW-90 and SA-90.

Dow is a global leader in materials science serving multiple markets. In 2023, it reported sales of approximately $45 billion. Carbice develops scalable interface solutions using CNT technology since its founding in 2011.

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