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Packaging Innovation Awards ceremony set for October at Tokyo Pack

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Jim Fitterling Chair and Chief Executive Officer at Dow Chemical Company | LinkedIn

Jim Fitterling Chair and Chief Executive Officer at Dow Chemical Company | LinkedIn

Dow Announces 35th Packaging Innovation Awards Ceremony at Tokyo Pack 2024

SINGAPORE – July 10, 2024 – Dow (NYSE:DOW) announced that the 35th Packaging Innovation Awards (PIA) will culminate in an awards ceremony scheduled for October this year at Tokyo Pack 2024.

This year's edition saw a record-breaking number of entries, with over 300 submissions from packaging professionals and companies worldwide. Following a rigorous evaluation process led by 18 judges from global packaging value chains in June 2024, the finalist entries will be revealed in August.

Winners will be unveiled at a ceremony on October 24 at Tokyo Pack, attended by industry leaders across the packaging value chain. This marks the first time the PIA awards ceremony is held in Asia. Winning entries will also be displayed at Tokyo Pack from October 23 to 25.

“We are incredibly excited to be unveiling the winners in Asia this year. Asia is a hotbed of innovation in the packaging industry, and this move reflects the region's growing importance in shaping the future of sustainable packaging solutions that contribute meaningfully to human progress,” said Daniella Souza Miranda, global marketing director, Dow.

David Luttenberger, jury chairperson for the 35th edition of PIA and global packaging director for Mintel Group Ltd., commented on the program's significance: “Our judges gathered in Bangkok to evaluate each and every submission, ensuring that we cast the spotlight on innovations that will shape the future of our industry. Award programs like the Dow Packaging Innovation Awards play a vital role in encouraging and recognizing advancements in packaging that prioritize sustainability and responsible practices. The record-breaking participation this year is a testament to the industry's commitment to building a better future.”

Since its inception, PIA has been recognized as one of the premier accolades for breakthroughs in technological advancement, sustainability, and enhanced user experience within the packaging industry. It offers a platform for professionals globally to showcase their innovative designs and gain recognition among peers. Entries are evaluated based on their ability to leverage cutting-edge technologies, benefit society at large, and provide an enhanced user experience.

About Dow

Dow (NYSE: DOW) is one of the world’s leading materials science companies serving customers in high-growth markets such as packaging, infrastructure, mobility, and consumer applications. With operations in manufacturing sites across 31 countries employing approximately 35,900 people, Dow delivered sales of approximately $45 billion in 2023. Learn more about Dow’s commitment to innovation and sustainability by visiting www.dow.com.

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